NC254 Flux Gel/Paste is a no-clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. It may be used for general touch-up or rework of PCBs, and for attaching spheres to ball grid array (BGA) packages. With its superior wetting ability, NC254 results in bright, smooth, and shiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapour phase soldering systems. Residues that remain on surfaces after soldering are clean, leaving a consmetically appealing repair that can be easily pin probed during in-circuit testing.
NC254 Flux Gel/Paste is compatible with all tin-lead and lead-free alloys and is suitable for a wide range of applications. It can be brushed, dispensed, pin transferred, or stencil printed.